NSI45060DDT4G【PDF 5/6 页】IC LED DRIVER/REG CCR DPAK

收藏本站

您好，
买卖IC网欢迎您。
请登录
免费注册

买卖IC网

Sheet目录46

1页 2页 3页 4页 [5页]6页

NSI45060DDT4G

http://onsemi.com

Comparison of LED Circuit using CCR vs. Resistor Biasing

ON Semiconductor CCR Design

Resistor Biased Design

Constant brightness over full Supply Voltage

(more efficient), see Figure 10

Large variations in brightness over full Automotive Supply Voltage

Little variation of power in LEDs, see Figure 11

Large variations of current (power) in LEDs

Constant current extends LED strings lifetime, see Figure 10

High Supply Voltage/ Higher Current in LED strings limits lifetime

Current decreases as voltage increases, see Figure 10

Current increases as voltage increases

Current supplied to LED string decreases as temperature

increases (self-limiting), see Figure 2

LED current decreases as temperature increases

Single resistor is used for current select

Requires costly inventory

(need for several resistor values to match LED intensity)

Fewer components, less board space required

More components, more board space required

Surface mount component

Through-hole components

Figure 10. Series Circuit Current

Figure 11. LED Power

(V)

100

200

300

400

= 25癈

Circuit Current with

CCR Device

Circuit Current

with 125 W

Representative Test Data

for Figure 8 Circuit, Current

of LEDs, FR4 @ 300 mm

2 oz Copper Area

500

= 25癈

LED Power with

CCR Device

LED Power

with 125 W

Representative Test Data

for Figure 8 Circuit, Pd of

LEDs, FR4 @ 300 mm

2 oz Copper Area

600

Current Regulation: Pulse Mode (I

reg(P)

) vs DC

Steady-State (I

reg(SS)

)

There are two methods to measure current regulation:

Pulse mode (I

reg(P)

) testing is applicable for factory and

incoming inspection of a CCR where test times are a

minimum. (t <

300 ms). DC Steady-State (I

reg(SS)

) testing

is applicable for application verification where the CCR will

be operational for seconds, minutes, or even hours. ON

Semiconductor has correlated the difference in I

reg(P)

reg(SS)

for stated board material, size, copper area and

copper thickness. I

reg(P)

will always be greater than I

reg(SS)

due to the die temperature rising during I

reg(SS)

. This heating

effect can be minimized during circuit design with the

correct selection of board material, metal trace size and

weight, for the operating current, voltage, board operating

temperature (T

) and package. (Refer to Thermal

Characteristics table).

发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

*型号	*数量	厂商	批号	封装

添加更多采购

采购需求

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

我的联系方式